Keep up with the domestic characteristic process semiconductor development route, and produce semiconductor masks with accuracy covering 130nm, 180nm, 250nm, 350nm, 500nm and above chip process nodes.

Continue to increase investment in research and development, and gradually realize the mass production and localization of 90nm and 65nm node masks.

Follow the national semiconductor industry development strategy, focus on the field of high-end semiconductor chip mask plate, deep cultivation of characteristic processes, breaking through 40nm and higher node processes.