Standard Binary Mask (binary mask is also known as bipolar mask), refers to the light mask composed of two parts of transmittance and transmittance, is the most widely used mask products, it is widely used in 365nm (I line) to 193nm (ArF) lithography process, The process that can be covered is 130nm and above the process node.
Optical Proximity Correction (OPC) is a lithographic resolution enhancement technology. In the process of chip manufacturing, when the size of the key pattern is smaller than the wavelength of the light source, the diffraction effect of light causes serious distortion of the edge of the pattern projected by the mask onto the silicon wafer, so it is necessary to correct and compensate the mask pattern in design, so as to improve the graphic resolution and image accuracy during wafer exposure. The company currently applies a number of OPC technologies and works closely with customers to develop OPC masks that meet their process requirements.
PSM (Phase Shift Mask) is a phase shift mask technology. It generates a phase difference of 180° through the MOSi layer, which can reduce the diffraction effect of light, improve the resolution of the mask pattern, and increase the focal depth. The company has initially developed PSM mask technology for the critical layer of the 180nm process node and will work closely with customers to further develop PSM masks that meet the requirements.
